Unlocking Precision:
Beyond Wafer Dicing
What is Wafer Dicing?
The technique of separating individual dies from a larger piece of semiconductor material (a wafer) is known as wafer dicing (or wafer scribing, or wafer cutting or die singulation). This term was created in the semiconductor industry to describe singulation of the individual die from the wafer.
Over the years, the APD dicing processes have evolved into something much broader that no longer fits the simple Wikipedia definition. Although we continue to process semiconductor wafers as our primary bread-and-butter product, a more precise categorization might be precision micromachining of hard, brittle materials.
What We Do
American Precision Dicing, Inc. manages a number of processes. Some are internal processes and some are owned by our long term partners.
Wafer Dicing Service
Die Sort, Pick, Place and Labeling
Laser marking
Customer Engagement Process
The most requested wafer dicing process involves the dicing of silicon wafers and is performed by most wafer dicing companies. The APD engagement process is described below. This process can handle the dicing of silicon wafers and is flexible enough to include a broad range of precision manufacturing projects.
- Project Communication: Communicate project details via email or phone.
- Quote and Material Shipment: APD generates a quote, customer accepts it, and ships material to us.
- Material Inspection: Receive and inspect material, contacting the customer if issues arise.
- Production Documentation: Create documentation and send it to the production floor.
- Production Process: Production manager reviews requirements, creates a plan, and will occasionally contact the customer.
- Wafer Processing: Wafer undergoes surface protection (if needed), mounting, dicing, washing, QA inspection, packaging, and shipping. And the invoice is sent to the customer.
Customer Service
our customers have been coming back for years. We must be doing something right.
Request a Quote
Please take a moment to fill out the form below to receive a personalized quote tailored to your specific needs and requirements.
Speed
For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum
Value
When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs. Experience operators who
Flexibility
Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers
Drop us a line
- (408) 539-9880
- sales@wafer-dicing.com
-
642 Giguere Court, San Jose
CA , 95133-1737
