APD performs wafer dicing of many different types of hard brittle materials such as:  Acrylic  Alumina  Aluminum Nitride  Aluminum-Titanium-Carbon  Beryllium  Bismuth Telluride  Borosilicate Glass  Capton  Ceramics  Copper-NiP  Copper-coated Alumina  Crown Glass  Ferrite  FR-4  Fused Silica  Gallium Antimonide  Gallium Arsenide (GaAs)  Garnet  Germanium  Glass  Graphite  Inconel  Lens Arrays  Lithium-Niobate  Lithium Tantalate  Magnesium Discs  Metallized Alumina  Metallized Silicon  Molybdenum  Nickel  Nickel Titanium  Optic wafers  Plastics  Polymer  Printed Circuit Boards  Pyrex  PZT  Quartz  QFN (Quad-Flat No-Leads)  Resin  Ruby  Rutile Crystal  Sapphire  Silicon  Silicon Carbide  Silicon Dioxide  Silicon Nitride  Silicon with Glass  Soda Lime Glass  Solar Cells  Stainless Steel  Terbium  Tungsten   Yttrium Aluminium Garnet  Yttrium Oxide  Zinc Selenide  Zirconia Ceramic

This is only a partial list. Please contact us for information on additional materials we can process for you. © 2000 - American Precision Dicing, Inc.