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Materials


APD performs wafer dicing of many different types of hard brittle materials such as:


 Acrylic
 Alumina
 Aluminum Nitride
 Aluminum-Titanium-Carbon
 Beryllium
 Bismuth Telluride
 Borosilicate Glass
 Capton
 Ceramics
 Copper-NiP
 Copper-coated Alumina
 Crown Glass
 Ferrite
 FR-4
 Fused Silica
 Gallium Antimonide
 Gallium Arsenide (GaAs)
 Garnet
 Germanium
 Glass
 Graphite
 Inconel
 Lens Arrays
 Lithium-Niobate
 Lithium Tantalate
 Magnesium Discs
 Metallized Alumina
 Metallized Silicon
 Molybdenum
 Nickel
 Nickel Titanium
 Optic wafers
 Plastics
 Polymer
 Printed Circuit Boards
 Pyrex
 PZT
 Quartz
 QFN (Quad-Flat No-Leads)
 Resin
 Ruby
 Rutile Crystal
 Sapphire
 Silicon
 Silicon Carbide
 Silicon Dioxide
 Silicon Nitride
 Silicon with Glass
 Soda Lime Glass
 Solar Cells
 Stainless Steel
 Terbium
 Tungsten
  Yttrium Aluminium Garnet
 Yttrium Oxide
 Zinc Selenide
 Zirconia Ceramic

This is only a partial list. Please contact us for information on additional materials we can process for you.







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