American Precision Dicing began offering its services in 1999, in response to an unmet need for quick turn custom dicing of silicon wafers for the semiconductor industry. Since then APD's processes have evolved to become industry acclaimed solutions for a much broader range of materials. APD's principals have extensive backgrounds in Silicon Valley's high tech world.
APD has the ability to:
make cuts as narrow as 25 microns wide
perform trenching with variations in depth to < 5 microns over a 200 mm cut
process wafers as thin as 50 microns
cut wafers as thick as 10 mm
handle wafers as large as 300 mm
cut die as small as 100 microns square
place cuts inside of cuts to create a custom trench profile
make standard entry cuts and plunge cuts
ship in gel packs and on tape & ring
Description of Wafer Dicing Services
APD is a fast turn wafer dicing service that has been around since 1999. We use precision diamond saws and lasers to dice and machine a large variety of wafers made of various types and combinations of hard brittle materials. We have diced, cut and scribed wafers of silicon, glass, ceramics, sapphire and many other materials.
What is wafer dicing?
Over the years, it has morphed into something much broader. Looking over the list of applications shown at the end of this article, one can see it no longer fits that simplistic definition. As can be seen in those examples it would be difficult to associate many of them with wafers or dicing.
The most requested wafer dicing process involves silicon wafer dicing and is performed by most wafer dicing companies. The process is described as follows:
Receive and inspect material to make sure it survived the trip to our facility. We always contact the customer if there are issues.
Create production documentation and send to production
Production manager reviews customer requirements and creates a processing plan. Using not only his experience but also the decades long database of previous jobs that have been processed.
If surface protection is required, it is added at this point.
Material is mounted for dicing and left to finish curing to the mounting medium.
The proper blade is chosen and installed on the dicing saw and dressed.
The machine is programmed and the wafer is installed on the dicing saw.
The wafer is then cut to the customer’s specifications.
After the wafer has been diced, it is washed in a high pressure spin washer.
After washing and drying the wafer is sent to QA where it is inspected and a report is created.
The wafer is then packaged and sent to the customer.