Precision Semiconductor Die Sort, Pick and Place, and Labeling Services

After wafer dicing, careful handling of singulated die is critical. While many customers request their cut wafers remain on the dicing tape, American Precision Dicing (APD) offers post-dicing support for customers who require individual die extraction, sorting, inspection, placement, labeling, and custom packaging.

Because no two projects are identical, APD does not force every job into a single process. Depending on the customer's specific requirements, including die size, material sensitivity, volume, and lead time, APD supports manual, semi-automatic, and automated die handling workflows when appropriate for the project.

This flexibility allows us to match the handling method to the project, whether that involves custom, low-volume engineering runs requiring delicate manual extraction, or highly repeatable production batches where semi-automatic or automated handling provides the best efficiency.

APD provides semiconductor die pick and place services for customers who need singulated die transferred from dicing tape into waffle packs, gel packs, trays, tape and ring, film frames, or customer-specified carriers. Unlike SMT pick and place for PCB assembly, our work focuses on post-dicing die handling, die sorting, inspection, placement, labeling, and packaging for semiconductor and advanced materials projects.

Die sorting is the process of separating different types of singulated dies based on specific engineering requirements, shape, size, location on a die map, or test results. We can quickly and accurately sort based on visual indicators like black dot markings or complex test result maps. APD is highly experienced in navigating complex die maps, including multi-project wafers where different areas of the wafer must be carefully isolated.

Die picking involves removing the singulated die from the holding medium. APD is equipped to extract die from standard dicing tape, UV release dicing tape, and Van der Waals dicing tape.

During the picking process, our team can perform visual inspections of the individual die pieces. We actively screen for customer-defined criteria, including:

Chips and cracks

Cut placement accuracy

Peeling of gold or metals from the backside

Sidewall fracturing

Custom inspection requests tailored to your project

Once die pieces are sorted, picked, and inspected, they must be safely transferred into a carrier for shipping or further processing. APD supports standard and highly customized placement requests, including specific sequencing, lot separation, and special orientation requirements.

We can place singulated die into a variety of handling media, including:

Waffle packs

Gel packs

Vacuum-release gel packs

Trays

Tape and ring / Film frames

Customer-supplied custom containers

Maintaining traceability is essential. Die labeling involves marking the container the die has been picked into, or in certain cases, marking the die itself. APD supports specialized formatting for part numbers, barcodes, lot IDs, and QR codes. We can apply these as labels to your packaging media, write identifying information directly on the adhesive film of tape and ring carriers, or utilize our in-house laser marking system directly on the die depending on the material.

Located in San Jose, California, APD combines decades of wafer dicing expertise with careful, responsive post-dicing die handling. Whether your project requires careful manual handling, semi-automatic support, or an automated workflow, we align our capabilities with your volume, material, schedule, and handling requirements.

Need singulated die sorted, inspected, labeled, or placed into custom media? Contact our team to discuss your specific volume, handling, and packaging requirements for a fast and accurate semiconductor die pick and place quote.