Here are some specific applications where we have successfully applied our knowledge to provide cutting edge solutions.


  • Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.

  • Micromachining of various sizes of Nitinol springs and tubes.


  • Cutting of 750 micron diameter glass and ceramic tubes.

  • Cutting of custom sized microscope slides with delicate surface processing.


  • Sawing of 1/4" thick quartz photomask.

  • Sawing Silicon/Pyrex material with a special blade to provide an 8 degree sidewall.

  • Providing "near Polished" cuts to eliminate a polishing step for the end customer.


  • Delivering cut silicon pieces on zero-tack tape to facilitate an automatic pick and place process.

  • Singulation of die pieces with very fragile bumps.

  • Cutting and picking of die pieces from a 50 micron thick wafer.


  • Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).

  • Precision routing of very small printed circuit boards from panels.