Here are some specific applications where we have successfully applied our knowledge to provide cutting edge solutions.
Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.
Micromachining of various sizes of Nitinol springs and tubes.
Cutting of 750 micron diameter glass and ceramic tubes.
Cutting of custom sized microscope slides with delicate surface processing.
Sawing of 1/4" thick quartz photomask.
Sawing Silicon/Pyrex material with a special blade to provide an 8 degree sidewall.
Providing "near Polished" cuts to eliminate a polishing step for the end customer.
Delivering cut silicon pieces on zero-tack tape to facilitate an automatic pick and place process.
Singulation of die pieces with very fragile bumps.
Cutting and picking of die pieces from a 50 micron thick wafer.
Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).
Precision routing of very small printed circuit boards from panels.