Free, Interactive Die Per Wafer Calculator
Instantly calculate your die per wafer and visualize your dicing layout. Our free, interactive estimator goes beyond simple formulas. It generates a visual map of your wafer, showing good (green) and bad (red) dies, so you can see the true impact of kerf size, edge exclusion, and cut placement.
Input Parameters
SEMI Dimension : --
Layout Visualization
Click/touch and drag on canvas to manually adjust cut pattern.
Results
Current Ch 2 Cut Distance (X-axis): 0 mm
Current Ch 1 Cut Distance (Y-axis): 0 mm
Good Dies (Current): N/A
Optimal Ch 2 Cut Distance (X-axis): N/A
Optimal Ch 1 Cut Distance (Y-axis): N/A
Max Good Dies (Optimal): N/A
Enjoying this free estimator? APD can dice it for you.
While wafer dicing is our core competency, APD also provides related singulation and post-dicing support. Our capabilities include wafer dicing, wafer coring, and PCB depanelization.
We routinely process semiconductor, optical, ceramic, and composite substrates such as Silicon, Gallium arsenide, Glass, Quartz, Ceramics, Alumina, Sapphire, Silicon carbide, FR4, and other hard and brittle substrates.
We also offer specialized processing and die handling services, including die sort, pick and place, labeling, photoresist application and removal, wafer backgrinding, and laser marking.
How to Find Your Maximum Wafer Yield
Simple online formulas can give you a basic number, but they can't help you visualize your layout or see how a simple shift in cut placement impacts your final die count. This tool is designed for engineers, researchers, and fab managers who need a more accurate, visual estimate.
Here's how to use it:
01 Enter Your Inputs
- Wafer Size: (Round or Rectangular)
- Die Dimensions: (Width and Height)
- Process Parameters: (Kerf/Blade Width and Edge Exclusion)
02 Find the Max
Click "Find Optimal Placement" to see the absolute maximum number of good dies you can achieve.
03 Drag to Optimize
This is our key feature. Click and drag the grid (with a mouse or touch) to manually adjust the dicing pattern. Watch the "Good Dies" count update in real-time. This lets you experiment with different cut placements in seconds.
FROM THEORETICAL YIELD TO REAL-WORLD RESULTS
A perfect calculation is the first step. Flawless execution is the second.
The maximum yield from this calculator is only theoretical. In a physical production environment, achieving that number depends entirely on the precision of your dicing partner. A slight misalignment, a worn blade, or improper feed speed can instantly turn your 'good dies' (green) into expensive scrap.
This is where we come in.
American Precision Dicing (APD) is not a software company; we are a world-class semiconductor service facility in San Jose, CA. We built this free tool because, for over 25 years, we have lived these calculations with our clients every single day.
Our expert technicians use industry-leading dicing saws to turn your plan into a physical reality. We are ISO 9001 certified and ITAR-compliant, trusted by the world's top R&D labs and semiconductor firms to deliver perfect, high-yield cuts—every time.
Don't risk your valuable wafers. When you're ready to move from estimation to production, send your specifications to the team that built the tool."
