300mm (12 inch) Wafer Dicing
We have been dicing 300mm (12 inch) wafers for some time now. However, recently we upgraded our processes related to those wafers. We purchased a brand new Accretech SS30 to enhance our ability to process these large wafers. Shown below is that machine and comments on its capabilities.
If you have a 300mm wafer that requires dicing we would love to cut it on our new machine.
Wafer Dicing Capabilities
Processes 300 millimeter wafers - of course it can also process any diameter wafer smaller than that.
Awesome Optics - No more guessing as to where the lane markers are.
Intuitive GUI - Large touchscreen with large buttons and a very logical layout.
Fantastic Accuracy - Plus or minus 2 microns absolute accuracy across the face of a 300mm wafer. Plus or minus 1 micron repeatability.
Ludicrous Spindle Speed - 60k rpms... about twice the speed of the old machine. This comes in handy when trying to get a near polished cut.
Artificial Intelligence used in the kerf check function - This is way better than the way we used to do it.
Can store 10,000 process parameter combinations - It will be so much easier to set up a job we have processed before.
Easy to fix when things break - Any complex machine will eventually fail. Accretech has done a fantastic job of making all parts of this machine easily accessible.