About Us
APD has been a trusted provider of fast-turn wafer dicing services since 1999. Utilizing precision mechanical dicing saws equipped with diamond blades, we excel in dicing and machining a wide variety of wafers composed of diverse hard, brittle materials. Our expertise extends to silicon, glass, ceramics, sapphire, silicon carbide, and many other substrates.
APD stands out as the fastest wafer dicing service provider, offering rapid turnarounds that set us apart. For small jobs, we provide same-day quick turns with express delivery, ensuring fast service for those urgent projects. Local customers can even benefit from while-you-wait quick turns. Our speed, combined with precision, allows us to consistently meet the tightest deadlines.
Our clientele includes universities, R&D departments of major corporations, low to medium volume production operations, start-ups, and both private and federal research labs.
Explore our blog for detailed insights into our capabilities and process roadmap.
What We Do
APD provides a diverse range of services, expertly developed in-house or managed in collaboration with our trusted long-term partners.
Wafer Dicing Service
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Photoresist
Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.
Die Sort, Pick & Place
Optimizing wafer processing with meticulous sorting, pick & place, and labeling.
Laser Marking
Utilizing advanced laser technology for precise and permanent serial number etching on wafers.
Wafer Coring
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
Wafer Dicing Service
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Photoresist
Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.
Our Service Principles
At APD, we prioritize speed, value, and flexibility. These principles guide our commitment to delivering exceptional wafer dicing services, ensuring efficient, cost-effective, and customized solutions for our clients.
Speed
For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum efficiency.
Value
When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs.
Flexibility
Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers
Our Valued Customers
Our valued customers include leading companies, research labs, and universities who trust us for their wafer dicing and processing needs.
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This is a paragraph. Writing in paragraphs lets visitors find what they are looking for quickly and easily.
This is a paragraph. Writing in paragraphs lets visitors find what they are looking for quickly and easily.
This is a paragraph. Writing in paragraphs lets visitors find what they are looking for quickly and easily.
Company Overview
APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice and machine a large variety of wafers made of various types and combinations of hard brittle materials.
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