Back Grinding
American Precision Dicing, Inc.: Your Trusted Partner in Wafer Backgrinding, Polishing, and CMP
In the fast-paced world of semiconductor manufacturing, where innovation thrives on ever-shrinking geometries and intricate functionalities, precision and quality are the cornerstones of success. At American Precision Dicing, Inc., we understand these critical requirements. We are a one-stop shop for all your wafer backgrinding, polishing, and chemical-mechanical polishing (CMP) needs, delivering exceptional results and unmatched customer service.
Unparalleled Expertise in Wafer Backgrinding and Polishing
Wafer back grinding (thinning) and polishing are fundamental processes in semiconductor fabrication. Back grinding meticulously reduces wafer thickness to precise specifications, enabling subsequent steps like die separation and advanced packaging techniques. Polishing meticulously refines the surface, ensuring a mirror-like finish that minimizes defects and imperfections. This pristine finish is crucial for optimal device performance and reliability.
Our team of seasoned professionals leverages their extensive experience and in-depth knowledge of semiconductor processes to deliver exceptional results. We meticulously select grinding wheels with tailored abrasive materials and precisely controlled grit sizes to ensure precise and uniform material removal during back grinding. Specialized adhesive back grinding tape safeguards your valuable wafers throughout the process, and we utilize deionized water to eliminate contamination concerns.
Industry-Leading Chemical-Mechanical Polishing (CMP) Services
To achieve ultra-flat wafer surfaces that are essential for modern integrated circuits, we offer industry-leading chemical-mechanical polishing (CMP) services. CMP is a highly advanced technique that combines the power of chemical reactions with precise mechanical abrasion to remove unwanted materials and surface irregularities. This meticulous process results in unmatched planarity, a critical factor for boosting device performance and reliability in today’s cutting-edge integrated circuits.
The American Precision Dicing Advantage
Unwavering Commitment to Quality:
We are a company built on a foundation of quality. Our unwavering commitment to exceeding your expectations is reflected in our consistent, high-quality results that meet the most stringent demands of the semiconductor industry.
Experience You Can Trust:
Our team of seasoned professionals brings a wealth of experience in the semiconductor industry to the table. This expertise ensures your wafers are handled with meticulous care throughout every step of the back grinding, polishing, and CMP processes.
Timely Delivery:
We understand that time is of the essence in the fast-paced world of semiconductor manufacturing. That's why we prioritize efficient processes without sacrificing precision, ensuring you receive your wafers back on time to keep your production lines running smoothly.
Collaborative Partnership:
We view ourselves as an extension of your team, working collaboratively to understand your unique wafer processing goals and objectives. We take pride in open communication and exceeding your expectations at every turn.
Contact American Precision Dicing, Inc. Today
Let our expertise in wafer back grinding, polishing, and CMP elevate your semiconductor manufacturing processes. We are confident that our commitment to quality, extensive experience, and collaborative approach will make American Precision Dicing, Inc. your trusted partner in achieving success. Contact us today to discuss your requirements and how we can help you achieve your manufacturing goals.
