Wafer Coring Calculator
Use our free Wafer Coring Calculator to maximize the number of smaller circular disks, optical windows, or substrate coupons cored from a larger mother wafer. Featuring multi-pattern circle packing algorithms, kerf loss compensation, and a complete CNC coordinate generator, this tool provides machine operators with exact X, Y, and radial (R) centerpoints for rapid laser, Synova waterjet, or mechanical core drill setup.
Key features include:
- Multi-Pattern Packing Engine: Evaluates concentric ring, hexagonal, and square circle-packing models to find the highest output core layout.
- Kerf & Spacing Compensation: Automatically incorporates beam/tool kerf into the core spacing pitch, preventing undersized cored disks.
- Dual CNC Zero Reference Points: Switch coordinates between Wafer Center $(0,0)$ and Top Center / 12 o'clock Edge $(0,0)$ for direct Synova laser saw programming.
- Complete CNC Coordinate Table: Generates a full itemized listing of X, Y, and radial distance (R) for every numbered core.
- Smart Unit Conversion: Convert seamlessly between millimeters (
mm) and inches (in) with 3-decimal precision.
Coring Parameters
SEMI Dimension : --
Layout Visualization
Click/touch and drag on canvas to manually adjust position offset.
Coring Results
Total Yield (Valid Cores): 0
Active Reference Point: Wafer Center (0,0)
| Core # | X Center ( mm ) | Y Center ( mm ) | Radial Dist R ( mm ) |
|---|---|---|---|
| No cores placed. | |||
How to Find Your Maximum Wafer Yield
Simple online formulas can give you a basic number, but they can't help you visualize your layout or see how a simple shift in cut placement impacts your final die count. This tool is designed for engineers, researchers, and fab managers who need a more accurate, visual estimate.
Here's how to use it:
01 Enter Your Inputs
- Wafer Size: (Round or Rectangular)
- Die Dimensions: (Width and Height)
- Process Parameters: (Kerf/Blade Width and Edge Exclusion)
02 Find the Max
Click "Find Optimal Placement" to see the absolute maximum number of good dies you can achieve.
03 Drag to Optimize
This is our key feature. Click and drag the grid (with a mouse or touch) to manually adjust the dicing pattern. Watch the "Good Dies" count update in real-time. This lets you experiment with different cut placements in seconds.
FROM THEORETICAL YIELD TO REAL-WORLD RESULTS
A perfect calculation is the first step. Flawless execution is the second.
The maximum yield from this calculator is only theoretical. In a physical production environment, achieving that number depends entirely on the precision of your dicing partner. A slight misalignment, a worn blade, or improper feed speed can instantly turn your 'good dies' (green) into expensive scrap.
This is where we come in.
American Precision Dicing (APD) is not a software company; we are a world-class semiconductor service facility in San Jose, CA. We built this free tool because, for over 25 years, we have lived these calculations with our clients every single day.
Our expert technicians use industry-leading dicing saws to turn your plan into a physical reality. We are ISO 9001 certified and ITAR-compliant, trusted by the world's top R&D labs and semiconductor firms to deliver perfect, high-yield cuts—every time.
Don't risk your valuable wafers. When you're ready to move from estimation to production, send your specifications to the team that built the tool."
